added clamping diode D6 per Paul's recommendation, to help protect U17
also reduced pad size on ADC footprint to help prevent solder bridging
updated a few footprint silkscreens to more closely match original rev3 board
added note in control board schematic recommending U26 Pin 2 trace length minimization
generated updated gerber zip files
TODO: update IC pads to match more closely to original rev3 board if it will make soldering easier
合并状态:已合并 合并于 2025-08-05 关闭于 2025-08-05 0 条评论